TY  - CONF

T1  - Analysis of Bond Wires and Proposal for Compensation Circuits in 73 GHz Applications

JO  - 2024 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON)

UR  - https://doi.org/10.1109/mapcon61407.2024.10923525

PY  - 2024/12/09

AU  - Joseph SD

AU  - Askre S

AU  - Ball EA

ED  - 

DO  - DOI: 10.1109/mapcon61407.2024.10923525

PB  - IEEE

SP  - 1

EP  - 4

Y2  - 2025/04/30

ER  -